Wetness Tester SP-2
It is a wettability tester that adopts the SP tension method (profile heating method).
SP-2 is a wettability testing device for solder paste, component electrodes, and printed circuit boards in surface mounting, utilizing the SP tension method (profile heating method). The entire wettability process can be observed through a glass window. With a preheat function and built-in powerful heater, it can achieve the same or optimal temperature profile as in actual reflow processes. Additionally, by employing an electro-balance sensor, it enables the detection of smaller forces, allowing for the wettability evaluation of microchip components sized 1005 and 0603. Conditions can be set, measurements operated, and results such as wetting time and wetting force automatically analyzed using a computer (with dedicated software). Evaluation tests for solder wire are also possible. Furthermore, measurements using the wetting balance method, micro-wetting balance method, and rapid heating method are available (optional). It is ideal for wettability evaluations related to lead-free solder (paste, components, temperature conditions). For more details, please contact us or refer to the catalog.
- Company：マルコム
- Price：Other
